本設備用於Mini Led 燈板雷射除膠工站，對LED晶粒上膠後進行測高、對位、雷射除膠，以及除膠後的視覺檢查。
設備全程搭配精準的AOI光學測高及視覺量測系統，於雷射除膠過程中及完成後進行視覺監控，量測除膠後XY軸與深度之資料，不傷阻焊層，為一全自動化晶粒雷射除膠之精密設備。
", "Precision_Automation_Equipment-3-0" : "MEMS Mirror自動化精密組裝設備", "Precision_Automation_Equipment-3-1" : "此設備涵蓋MEMS精準定位與組裝、磁石模組點膠等，可實現1mm、4mm、8mm直徑高精度MEMS Mirror模組化封裝，確保產品穩定性與一致性。設備整合視覺定位技術，達成微組裝精度±0.2°，並搭載智能視覺檢測系統，將原需7道工站縮減至3站，大幅提升生產效率，終端產品應用於雷射LIDAR、機器人、消費電子、車載顯示等領域需求。" } }, "en": { "var":{ "Precision_Automation_Equipment-0-0" : "Precision Laser Cutting Machinery", "Precision_Automation_Equipment-0-1" : "Due to its ultra-short pulse width, it produces almost no heat-affected zone (HAZ), effectively minimizing material ablation and thermal stress, thereby improving cutting quality and accuracy.", "Precision_Automation_Equipment-1-0" : "Mini LED Laser Repair Equipment", "Precision_Automation_Equipment-1-1" : "This equipment is tailored for Mini LED repair workstations, offering a comprehensive range of functions, including LED chip height measurement, laser desoldering, solder pad leveling, solder paste stamping, chip transfer from blue tape to substrate, and laser soldering. The entire process is supported by a high-precision optical height measurement system and a vision inspection system, ensuring accuracy at every repair stage.
It provides comprehensive IPQC inspection and operational data for each repair station, enabling thorough quality control. Additionally, the system performs pre-operation self-checks to detect any abnormalities in CCD cameras, soldering modules, chip nozzles, blue tape ejector modules, and laser parameters, ensuring optimal machine accuracy and reliability throughout the repair process.
", "Precision_Automation_Equipment-2-0" : "Laser De-Coating Machinery", "Precision_Automation_Equipment-2-1" : "This advanced equipment is specifically designed for the laser de-coating workstation in Mini LED panel manufacturing. It integrates multiple functions, including height measurement, alignment, laser de-coating, and post-processing visual inspection following adhesive application on LED chips.
The system incorporates a fully integrated, high-precision AOI optical height measurement and vision inspection system. During and after the laser de-coating process, it enables real-time visual monitoring while accurately measuring the XY-axis position and depth of the de-coated area, ensuring the solder mask remains intact. This state-of-the-art machine represents a fully automated, high-precision solution for laser de-coating of LED chips.
", "Precision_Automation_Equipment-3-0" : "MEMS Mirrors Precision Assembly Machine", "Precision_Automation_Equipment-3-1" : "This advanced machine is specially designed for high-precision positioning, adhesive dispensing and assembly for MEMS mirror and magnet module. It supports high-precision module packaging for MEMS mirrors with diameters of 1mm, 4mm, and 8mm, delivering exceptional product stability and consistency.
The system incorporates cutting-edge vision-based positioning technology, achieving micro-assembly accuracy of ±0.2°, and is equipped with an intelligent vision inspection system for quality assurance. By streamlining the production process and reducing the number of required workstations from seven to three, it significantly enhances production efficiency. The final products are widely utilized in applications such as laser LiDAR, robotics, consumer electronics, and automotive displays.
" } } }