{
    "common": {
        "var" : {
        },
        "title" : "Innostar {Key_Milestones}",
        "html": {
            "data-title" : "{Key_Milestones}",
            "Header-1-img" : {
                "img" : "images/background/background-17.jpg"
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        }
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    "zh-Hant": {
        "html": {
            "Key_Milestones-0": {
                "sectionpackage": {
                    "color" : "#f5f5f5",
                    "content" : {
                        "0-timelinepackage" : {
                            "重要紀事" : {
                                "2004 " : {
                                    "0-p-indented" : "創新服務股份有限公司成立，於台中大甲設立工廠，資本額新台幣8,000仟元。",
                                    "1-p-indented" : "推出第一代塑膠剪切機。"
                                },
                                "2005 " : {
                                    "0-p-indented" : "推出單站式鏡頭組裝機。"
                                },
                                "2008 " : {
                                    "0-p-indented" : "推出光學觸控屏校正設備。"
                                },
                                "2009 " : {
                                    "0-p-indented" : "推出第一代多鏡片鏡頭自動組裝機。"
                                },
                                "2011 " : {
                                    "0-p-indented" : "推出伺服刀座鏡片澆口自動剪切機。",
                                    "1-p-indented" : "推出耐熱鏡片（Reflow Lens）自動組裝點膠設備。"
                                },
                                "2012 " : {
                                    "0-p-indented" : "推出高階鏡頭自動組裝機。"
                                },
                                "2014 " : {
                                    "0-p-indented" : "切入半導體先進測試製程，開發半導體晶圓級測試MEMS（微機電）探針卡自動植針設備",
                                    "1-p-indented" : "通過ISO 9001品質認證。"
                                },
                                "2015 " : {
                                    "0-p-indented" : "推出全球第一台半導體晶圓級測試MEMS（微機電）探針卡自動植針設備。"
                                },
                                "2016 " : {
                                    "0-p-indented" : "取得半導體晶圓國際大廠MEMS探針卡自動植針獨家代工業務。"
                                },
                                "2017 " : {
                                    "0-p-indented" : "開發蛇型（Cobra）自動植針設備。",
                                    "1-p-indented" : "開發彈簧針（Pogo Pin）自動植針&電性（FDR，Force Distance Resistance）量測設備。"
                                },
                                "2018 " : {
                                    "0-p-indented" : "取得半導體設備設計、製造、銷售之ISO 9001證書。",
                                    "1-p-indented" : "推出半導體Probe Card MEMS探針微整列模組。",
                                    "2-p-indented" : "開發MEMS探針移轉及檢測自動修復設備。",
                                    "3-p-indented" : "開發飛秒雷射鑽孔機。"
                                },
                                "2019 " : {
                                    "0-p-indented" : "中國子公司上海創崴醫療器材有限公司成立。",
                                    "1-p-indented" : "推出Mini LED自動化電測雷射修復及燈板自動化電測設備。"
                                },
                                "2020 " : {
                                    "0-p-indented" : "獲准入駐新竹科學園區。",
                                    "1-p-indented" : "開發精密飛秒雷射切割設備。"
                                },
                                "2021 " : {
                                    "0-p-indented" : "開發先進封裝製程-銅柱巨量移轉模組。",
                                    "1-p-indented" : "開發皮秒雷射精密加工設備。",
                                    "2-p-indented" : "除代工MEMS探針卡自動植針業務外，開始全面銷售自動植針設備。"
                                },
                                "2022 " : {
                                    "0-p-indented" : "開發先進封裝製程-銅柱巨量移轉設備。"
                                },
                                "2023 " : {
                                    "0-p-indented" : "開發新世代高效Dual Arm MEMS Probe Card自動植針設備。"
                                },
                                "2024 " : {
                                    "0-p-indented" : "現金增資60,000仟元，實收資本額276,670仟元。",
                                    "1-p-indented" : "推出先進封裝高密度銅柱端子模組。",
                                    "2-p-indented" : "開發MEMS探針卡Probe Card整體自動化維修解決方案。"
                                },
                                "2025 " : {
                                    "0-p-indented" : "現金增資62,799仟元，實收資本額362,799仟元。",
                                    "1-p-indented" : "開發先進封裝銅柱TGV基板自動化製造解決方案。"
                                }
                            }
                        }
                    }
                }
            }
        }
    },
    "en": {
        "html": {
            "Key_Milestones-0": {
                "sectionpackage": {
                    "color" : "#f5f5f5",
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                        "0-timelinepackage" : {
                            "Key Milestones" : {
                                "2004 " : {
                                    "0-p-indented" : "Innostar Service Inc. has established a manufacturing facility in Dajia, Taichung, with a capital investment of NTD 80 million.",
                                    "1-p-indented" : "Launched the lens auto-assembly machine."
                                },
                                "2005 " : {
                                    "0-p-indented" : "Launched a single-station lens assembly machine."
                                },
                                "2008 " : {
                                    "0-p-indented" : "Launched optical touch screen calibration equipment."
                                },
                                "2009 " : {
                                    "0-p-indented" : "ntroduced the multi-lens auto-assembly machine."
                                },
                                "2011 " : {
                                    "0-p-indented" : "Released the servo cutter for automatic lens gate cutting.",
                                    "1-p-indented" : "Developed the automated dispensing system for reflow lens assembly."
                                },
                                "2012 " : {
                                    "0-p-indented" : "Launched the high-end lens automatic assembly machine."
                                },
                                "2014 " : {
                                    "0-p-indented" : "Entered the semiconductor advanced testing field with automatic probe insertion technology for wafer test probe cards.",
                                    "1-p-indented" : "ISO 9001 quality certification has been obtained."
                                },
                                "2015 " : {
                                    "0-p-indented" : "Launched the world's first semiconductor wafer-level testing MEMS (Micro-Electro-Mechanical Systems) probe card automatic probe insertion equipment."
                                },
                                "2016 " : {
                                    "0-p-indented" : "Secured an exclusive OEM partnership to manufacture MEMS probe card automatic probe insertion systems for a globally renowned semiconductor wafer producer."
                                },
                                "2017 " : {
                                    "0-p-indented" : "Developed automated insertion equipment for Cobra probes.",
                                    "1-p-indented" : "Introduced automatic Pogo Pin insertion & electrical measurement equipment (FDR: Force, Distance, Resistance)."
                                },
                                "2018 " : {
                                    "0-p-indented" : "Obtained the ISO 9001 certification for the design, manufacturing, and sales of semiconductor equipment.",
                                    "1-p-indented" : "Launched MEMS probe micro-array module.",
                                    "2-p-indented" : "Developed MEMS probe transfer and inspection automatic repair equipment.",
                                    "3-p-indented" : "Developed a femtosecond laser drilling machine."
                                },
                                "2019 " : {
                                    "0-p-indented" : "The Chinese subsidiary, \"Shanghai TronWare Medtech Co. Ltd.\" was established.",
                                    "1-p-indented" : "Launched Mini LED automated testing and laser repair equipment for light panels."
                                },
                                "2020 " : {
                                    "0-p-indented" : "Approved for entry into the Hsinchu Science Park.",
                                    "1-p-indented" : "Developed precision femtosecond laser cutting equipment."
                                },
                                "2021 " : {
                                    "0-p-indented" : "Developed advanced packaging micro copper pillar mass transfer modules.",
                                    "1-p-indented" : "Developed precision laser micromachining equipment (femtosecond / picosecond lasers).",
                                    "2-p-indented" : "In addition to offering OEM services for MEMS probe card automatic probe insertion, we have launched full-scale sales of automatic probe insertion equipment."
                                },
                                "2022 " : {
                                    "0-p-indented" : "Developed advanced packaging micro copper pillar mass transfer equipment."
                                },
                                "2023 " : {
                                    "0-p-indented" : "Developed next-generation high-efficiency dual arm probe card MEMS automatic probe insertion equipment."
                                },
                                "2024 " : {
                                    "0-p-indented" : "Cash capital increase of NTD 60 million , bringing the paid-in capital to NTD 276.67 million .",
                                    "1-p-indented" : "Launched an advanced packaging micro copper pillar lead frame, entering the SiP double-sided packaging process.",
                                    "2-p-indented" : "Developed a fully automated repair solution for MEMS probe cards."
                                },
                                "2025 " : {
                                    "0-p-indented" : "Cash capital increase of NTD 60,000,000, bringing the paid-in capital to NTD 276,670,000.",
                                    "1-p-indented" : "Developed an automated manufacturing solution for advanced packaging copper pillar TGV glass core layer substrate."
                                }
                            }
                        }
                    }
                }
            }
        }
    }
}